Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...

Engineering considerations in multi-chiplet designs.

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

Leveraging patterns in formal verification to reach sign-off faster.

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...

The shift from generative AI to agentic AI will significantly increase the amount of compute power needed in data centers. Queries to search for and analyze data from multiple sources will be ...