According to projections from Towards Packaging, the global foam cushioning market is set to increase from USD 8.90 billion ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

Kemet Corp. has added the company’s KONNEKT high-density packaging technology to its family of KC-LINK capacitor range to meet growing demand in wide-bandgap (WBG) semiconductors, electric ...

Polyurethane foam can be divided into two categories, such as open-cell and closed-cell foam. The former is a plastic with incomplete cell walls and include holes through which air and liquid can ...