Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Not long ago, greater integration between the processing and packaging functions was seen partly as an emerging trend and partly as an interesting possibility—an intriguing “if” out there on the ...

Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...

A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has ...

SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

WEST LAFAYETTE, Ind. – Purdue University researchers have developed a large-scale manufacturing process that may change the way some grocery store foods are packaged. According to Credence Research, ...