If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

[Andrew Zonenberg] has crossed a line in his electronic hobby projects. The Ball Grid Array (BGA) is a type of chip footprint which most hobbyists leave to the professionals. But he’s learned the ...

The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Ironwood Electronics’ SG-BGA-6410 socket, a ball-grid-array (BGA) socket for 0.8-mm-pitch, 96-pin BGA ICs—operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Designed for 8- by ...

While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs. BGA ...

State-of-the-art microfabricated ion traps for quantum information research are approaching nearly one hundred control electrodes. We report here on the development and testing of a new architecture ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

There's been a bit of he-said/she-said going on with regards to Intel's future desktop roadmaps. Last year, news broke that the company was planning to move to soldered ball grid array (BGA) mounts ...

With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

Samsung Electro-Mechanics is accelerating its supply of flip chip (FC)-ball grid array (BGA) for application-specific integrated circuits (ASIC), which is rapidly growing alongside the emergence of ...